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product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays 1/22 datashee t ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 14 ? 001 tsz02201-0g3g0c200320-1-2 27.sep.2012 rev.001 white led driver with pwm brightness control for up to 11 leds in series bd60a00nux bd60a60nux general description this ic is boost dc/dc converter that can drive white led with constant current. more stabled white led lighting can be achieved by direct current connection without electric tolerance and high-speed response by current mode. moreover, separating ic power supply (2.7v to 5.5v) and coil power supply (2.3v to 20v) makes it possible to widen input range, which will be helpful to be applied to various kinds of applications. over voltage setting can be selected corresponding to the number of led lightings. bd60a00nux is for max 11 lightings, bd60a60nux is for max 6 lightings. features ? boost dc/dc converter ? drive led 11 lightings (vout=3.6v11+0.7v=40. 3v ) bd60a00nux ? brightness control by outside pwm signal (pwm frequency =100hz to 30khz, 25khz 1% dimming application) ? brightness control by dc input ? soft start function (1ms typ.) ? over voltage protection bd60a00nux: 42v (typ.) bd60a60nux: 28v (typ.) ? sbd open protection and output short protection ? over current protection ? led terminal over voltage protection ? uvlo key specifications ? operating power supply voltage range: 2.7v to 5.5v ? led maximum current: 30ma (max.) ? switching frequency: 600khz(typ.) ? quiescent current: 0.1 a (typ.) ? operating temperature range: -40 ? c to +85 ? c package w(typ.) x d(typ.) x h(max.) applications digital video cameras, digital single-lens reflexes, digital still cameras, digital photo frames, personal navigations (pnd), mobile phones, smart phones, mid, pda, hand-held computers, mp 3 players, gps, digital media players, etc. typical application circuit v son008x2030 2.00mm x 3.00mm x 0.60mm l1 10 h sw en gnd fb vin ccoil 4.7 f cout 2.2 f coil power 2.3v to 20 v d1 vout cin 1 f 11 leds pwm pwm control ic power 2.7v to 5.5v iset enable control bd60axxnux
2/22 datasheet d a t a s h e e t bd60a00nux bd60a60nux ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200320-1-2 27.sep.2012 rev.001 absolute maximum ratings parameter symbol ratings unit condition maximum applied voltage 1 vmax1 7 v vin, en, pwm, iset terminals maximum applied voltage 2 vmax2 45 v fb, sw, vout terminals bd60a00nux maximum applied voltage 3 vmax3 31 v fb, sw, vout terminals bd60a60nux operating temperature r ange topr -40 to +85 ? c storage temperature range tstg -55 to +150 ? c power dissipation 1 pd1 2000 mw *1 *1 4 layer (rohm standard board) has been mounted. when it?s used by more than ta=25 ? c, it?s reduced by 20mw/ ? c. recommended operating ratings (ta=-40 ? c to +85 ? c) parameter symbol ratings unit conditions operating power supply voltage vin 2.7 to 5.5 * v vin terminal operating coil voltage vcoil 2.3 to 20 v coil voltage *when the operating supply voltage is over 4.61v for bd60a00nux, please refer the application p.16 electrical characteristics (unless otherwise specified, ta=25 ? c, vin=3.6v) parameter symbol limits unit conditions min. typ. max. quiescent current iq - 0.1 1.0 a en=0v current consumption (no boost) iddnb - 1.5 3.0 ma en=2.8v, pwm=0v current consumption (boost) iddb - 2.5 5.0. ma en=2.8v, pwm=2.8v [en, pwm terminal] low input voltage range vthl - - 0.5 v high input voltage range vthh 1.4 - - v pull down register rcnt 65 100 135 k ? [switching regulator] fb terminal control voltage fb 0.56 0.70 0.84 v switching frequency fsw - 600 - khz max duty duty 90 95 - % fb=0v sw transistor on resistor ronn - 0.5 - ? isw=80ma sw transistor leak current iqsw - 0.1 2.0 a en=0v [protection] over current limit icoil - 750 - ma *1 over voltage limit bd60a00nux ovp1 40 42 44 v detect voltage of vout terminal over voltage limit bd60a60nux ovp2 26 28 30 v detect voltage of vout terminal over voltage limit hysteresis ovphy - 1 - v vout terminal leak current iqvout - 0.1 1.0 a en=0v shot key diode open protection sop - 0. 2 - v detect voltage of vout terminal led terminal over voltage protection ledovp 4.4 5.9 6.4 v pwm=2.8v detect voltage of low voltage uvlo - 2.2 - v vin falling edge [current driver] led maximum current ilmax - - 30 ma vin=4v, cout=1f led current accuracy ila ccu - - 3.0 % iled=20ma led current limit ilocp - 0 0.1 ma current limit value at iset resistor 1k ? setting led leak current iqled - 0.1 2.0 a en=0v iset terminal voltage iset - 0.6 - v *1 this parameter is tested with dc measurement.
3/22 datasheet d a t a s h e e t bd60a00nux bd60a60nux ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200320-1-2 27.sep.2012 rev.001 + + - osc control + - s q r tsd sw en gnd pwmcomp erramp fb vin thermal shutdown c urrent sense over current protect q1 vout + - over & under voltage protect pwm current driver iset uvlo pin description pin no. pin name in/out f unction terminal diagram 1 en in enable control b 2 vin in battery input c 3 pwm in pwm input b 4 iset in led current setting terminal a 5 fb in feedback voltage input b 6 vout in over voltage protection input b 7 gnd - gnd c 8 sw out switching terminal b pin esd type block diagram a gnd pin vin gnd c vin gnd pin b figure 1. pin esd type
4/22 datasheet d a t a s h e e t bd60a00nux bd60a60nux ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200320-1-2 27.sep.2012 rev.001 main characteristics examples led 6series, coil: vlf302512mt-100m led 10series, coil: vlf302512mt-100m condition: vin=3.6v led=6series iled sweep (10->30ma) cin=1 f/10v ccoil=1 f/25v cout=2.2 f/50v sbd=rb160m-60 coil=vlf302512mt-100m condition: vin=3.6v led=10series iled sweep (10->30ma) cin=1 f/10v ccoil=1 f/25v cout=2.2 f/50v sbd=rb160m-60 coil=vlf302512mt-100m
5/22 datasheet d a t a s h e e t bd60a00nux bd60a60nux ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200320-1-2 27.sep.2012 rev.001 main characteristics examples- continued ic power=5.0v, coil power=4v to 16v ? bd60a00nux ic power=5.0v, coil power=2.7v to 20v, led 8serial, led current =25ma, coil 1094as-10m (toko), sbd rb060m-60tr (rohm) ? bd60a60nux ic power=5.0v, coil power=2.7v to 20v, led 6serial, led current =25ma, coil 1094as-10m (toko), sbd rb521a-40tr (rohm) 70 75 80 85 90 95 234567891011121314151617181920 vcoil (v) efficiency (%) eff1 eff2 eff 1 = (vout x iled) / (vcoil x icoil) x100 eff 2 = (vout x iled) / (vcoil x icoil + vin x ivin) x100 70 75 80 85 90 95 234567891011121314 vcoil (v) efficiency (%) eff = (vout x iled) / (vcoil x icoil + vin x ivin) x100
6/22 datasheet d a t a s h e e t bd60a00nux bd60a60nux ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200320-1-2 27.sep.2012 rev.001 main characteristics examples- continued pwm 20khz duty 50% vout led current pwm 100mv/div 40s/div vout led current pwm pwm 20khz duty 1% 100mv/div 200ns/div
7/22 datasheet d a t a s h e e t bd60a00nux bd60a60nux ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200320-1-2 27.sep.2012 rev.001 main characteristics examples - continued ? bd60a00nux pwm duty ? led current ic power=5.0v, led 8serial, led current =25ma, pwm frequency = 20 khz, ta=25deg coil 1094as-10m (toko), sbd rb060m-60tr (rohm) functional descriptions 1) pwm current mode dc/dc converter this ic keeps output voltage invariably by setting pwm duty to make fb terminal 0.7v when the power is on. as for the inputs of the pwm comparator as the f eature of the pwm current mode, one is overlapped with error components from the error amplifier, and the other is overlapped with a current sense signal that controls the inductor current into slope waveform to prevent sub harmonic oscillatio n. this output controls internal nch tr via the rs latch. in the period where internal nch tr gate is on, energy is accumulated in the ex ternal inductor, and in the period where internal nch tr gate is off, energy is transferred to the output capacitor via external sbd. this ic has many safety functions, and their det ection signals stop switching operation at once. 2) soft start this ic has soft start function, which prevents rush current at turning on. after en and pwm are changed l ? h, soft start becomes effective within 1ms. soft start doesn't become effective even if enable is changed l ? h, after that. by changing en and pwm l ? h, soft start can become effective. since a soft start function stops working at the time of following pwm=h when en=h is held with pwm=l after en=h should input a pwm signal within 10ms. pwm off on on off off off on off off en soft star t soft star t rese t reset reset soft start time finish pwm en within 10ms figure 2. soft start possible to duty 0.4% at pwm=20 khz bd60a00nux vcoil vs efficiency vin=5vta=25 led 8 (26v) coil 1094as-10m(toko) sbd rb060m-60tr(rohm) led current 25ma pwm frequency 20khz 0.01 0.10 1.00 10.00 100.00 0.1 1.0 10.0 100.0 pwm duty (%) led current (ma) 0.4%
8/22 datasheet d a t a s h e e t bd60a00nux bd60a60nux ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200320-1-2 27.sep.2012 rev.001 protection ? over voltage protection at such an error of output open as t he output dc/dc and the led is not connected to ic, t he dc/dc boosts too much and the vout terminal exceeds the absolute maximum ratings , and may destruct the ic. therefore, when the vout becomes sensing voltage or higher, the over voltage limit pr otection works, turns off the switching tr, dc/dc will be stopped, and the output voltage goes down slowly. when output voltage becomes below the hysteresis voltage of over voltage protection, a boost function works and out put voltage reaches detection voltage again. this operation is repeated unless the abnor malities in application are recovered. ? schottky diode open protection in the case of external sbd is not connected to ic, or vout is shorted to gnd, the coil or in ternal tr may be destructed. therefore, at such an error as vout becoming 0.2v or below, turns off the out put tr, and prevents the coil and the ic from being destructed. and the ic changes from activation into non-activa tion, and current does not flow to the coil (0ma). ? thermal shut down this ic has thermal shut down function. the thermal shut down works at 175 ? c or higher, and the ic changes from activation into non-activation. ? over current protection over current flows the current detection resistor that is connected to between internal switching transistor source and gnd. current sense voltage turns more than detection voltage, over current protec tion is operating and it is prevented from flowing more than detection current by reduci ng on duty of switching tr without stopping boost. as over current detector of this ic is detected peak curren t, current more than over current setting value does not flow. < the estimate of the current value which need for the normal operation> as over current detector of this ic is detected the peak curr ent, it has to estimate peak cu rrent to flow to the coil by operating condition. in case of, switching frequency = fsw typ.=0.6mhz supply voltage of coil = vin inductance value of coil = l output voltage = vout total led current = iout average current of coil = iave peak current of coil = ipeak efficiency = eff on time of switching transistor = ton ipeak = (vin / l) (1 / fsw) (1-(vin / vout)) iave=(vout iout / vin) / eff ton=(iave (1-vin/vout) (1/fsw) (l/vin) 2) 1/2 as peak current varies according to whether there is the direct current superposed, the next is decided. (1-vin/vout) (1/fsw) < ton ? peak current = ipeak /2 + iave (continuous mode ccm) (1-vin/vout) (1/fsw) > ton ? peak current = (vin / l)ton (discontinuous mode dcm) (example 1) in case of, vin=6.0v, l=10h, fsw=0.6mhz , vout=32.5v, iout=25ma, current =85% ipeak = (6.0v / 10h) (1 / 0.6mhz) (1-(6.0v / 32.5v)) =0.82 a iave = (32.5v 25ma / 6.0v) / 85% = 0.16a ton = (0.16a (1-6.0v / 32.5v) (1 / 0.75mhz) (10h /6.0v) 2) 1/2 = 0.85s (1-vin/vout) (1 /fsw)=1.36s > ton peak current = (6.0v / 10h)0.85s =0.51a + - sw
9/22 datasheet d a t a s h e e t bd60a00nux bd60a60nux ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200320-1-2 27.sep.2012 rev.001 protection - continued ? led terminal over voltage protection when fb terminal becomes higher than 5.9v (typ.), ic senses the situation trouble after 100s and then stops constant current driver and dc/dc. ther efore ic becomes never heated, even if output and fb are both shorted. moreover, if fb terminal becomes lower than 5.9v (typ.), ic senses nor mal condition and activates constant current driver. ? prevention of led terminal over voltage protection malfunction as the below diagrams show, voltage drop of fb terminal becomes slow when pwm operates by connecting capacitor on a parallel with led and decreasing led current. at that time , led terminal voltage protection works after condition of fb terminal > 5.9v keeps more than 100s. led terminal voltage protection might stop current driver and dc/dc and also turns off leds, so that please set up coil selection and led cu rrent setting less than 100s until fb terminal < 5.9v. ? low voltage detect protection (uvlo) supply voltage(vin) becomes lower than low voltage detec t voltage 2.2v(typ.), ic stops dc/dc and constant current driver. moreover, this function can be off by boosting supply voltage up to more than hysteresis voltage. dc/dc current driver vin reset 2.20 v 5% 0v a ctive a ctive 2.32 v fb vou t current driver fb reset 5.9 v a ctive dc/dc a ctive 100s reset reset reset pwm l h en l h current driver fb reset 5.9v 0.7v a ctive dc/dc a ctive 100s reset reset reset pwm l h
10/22 datasheet d a t a s h e e t bd60a00nux bd60a60nux ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200320-1-2 27.sep.2012 rev.001 operating of the a pplication deficiency 1) when 1 led or 1string open during the operating since fb terminal is set to 0v when set to open, output boosts up to the over voltage protection voltage. when over voltage is detected, the boosting operati on stops and then output voltage goes down slowly. later, if output voltage becomes less than hysteresis of over cu rrent protection, output voltage keeps bo osting up to over voltage protection voltage again. figure 3. led open detect 2) when led short-circuited in the plural even if one led short-circuits during boos t operation, it usually passes along le d and it is turned on. by making led shorted, fb terminal voltage increases by led vf. t herefore output voltage becomes lower by led vf, and the condition turns to be normal. figure 4. one led shorted figure 5. fb terminal ? vout terminal shorted fb fb output vout fb voltage led connection normal open led current 20ma 0ma hysteresis voltage 0.7v+vf of led fb vou t led current 20ma 0.7v led short vf of led vf of led fb vou t fb vout led current 20ma 0.7v led short vin 5.9v 0.1ma 100s
11/22 datasheet d a t a s h e e t bd60a00nux bd60a60nux ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200320-1-2 27.sep.2012 rev.001 operating of the applicati on deficiency - continued 3) when schottky diode (sbd) remove in the situation that connection is opened and also dc/dc is activated, sw terminal voltage becomes more than rated voltage due to a lack of parts that c an accept the current accumulated inside the coil. consequently ic might be destroyed. to prevent the ic destruction, sbd open protecti on is functioned. sw terminal is never destroyed as boosting operation is stopped after vout terminal detects less than 0.2v. 4) when resistance linked to an iset terminal short-circuits since resistor connected to iset terminal becomes 0 ? , led current setting value becomes more than rating. in order to avoid this trouble, this ic has led current limit protection. by using this function, setting current of rating current driver becomes 0ma, and the current flow of led is almost same as leak current. control signal input timing when input control signals such as enable and pwm without completing the standup of supply voltage (vin), be careful of the following points. input each control signal after vin exceeds 2.2v and uvlo is off. when input enable and pwm, the standup time should be plac ed as min.100s from 2.2v to stable voltage for vin. since a soft start function stops working at the time of following pwm=h when en=h is held with pwm=l. after en=h should input a pwm signal within 10ms. start control (en) and select led current driver (pwm) this ic can control the ic system by en terminal and also turns off compulsorily by setting ?l? level input voltage 0.4v or below. it also powers on when en becomes more than ?h? level input voltage 1.4v. in the case of en=h, led current fixed by iset resistor with pwm=h flows. w hen it is selected at pwm=l, led current stop to flow. en pwm ic led current l l off off h l on off l h off off h h on current fixed by iset led current setting range led current sets up normal current by resi ster (riset) connected to iset voltage. each setting current is shown as below. normal current = 600/riset [a] normal current setting range is 10ma to 30ma, and also le d current at off setting is max 2a of leak current. iset normal current setting example riset led current 20.0k ? (e96) 30.0ma 24.0k ? (e24) 25.0ma 30.0k ? (e24) 20.0ma 56.0k ? (e24) 10.7ma vin 2.2v en min. 100 s pwm dc/dc vout figure 6. control signal input timing vin en min. 10 ms pwm dc/dc vout
12/22 datasheet d a t a s h e e t bd60a00nux bd60a60nux ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200320-1-2 27.sep.2012 rev.001 brightness control there are two dimming method available; the first method is ana log dimming that applies analog voltage to iset terminal, and the second method is digital dimming that inputs pwm to pwm terminal. since each method has the different merits, please choose a suitable method for the application of use. 1) current driver pwm control is controlled by prov iding pwm signal to pwm, as it is shown figure 7. the current set up with iset is chosen as the h section of pwm and the current is off as t he l section. therefore, the average led current increases in proportion to duty cycle of pwm signal. this method that internal circuit and dc/dc work, because it becomes to switch the driver, the current tolerance is a few wh en the pwm brightness is adjusted, so it makes it possible to brightness control unt il 0.4s (min1% at 25khz). and, don't use for the bri ghtness control, because effect of iset changeover is big under 0.4s on time and under 3s off time. typical pwm frequency is 100hz to 25khz. 2) analog dimming can be operated by applying voltage to iset terminal via resistor as the below figure shows. iset terminal voltage works to become 0.6v regardless of the conn ected resistor. led current increases iset terminal current 600 times, so that led current can be minimized by decreasi ng flow current into iset terminal using external dc input led current = 1000 x 0.6v 470k ? + 22k ? 1000 0.6v - dac output pwm led current coil current ic?s active current on off on off on off on figure 7. pwm sequence sw vin cin 4.7 f r1 24k ? cout 2.2 f 25ma vin 2.7v to 4.6v vout fb l1 10 h iset gnd en pwm reset pwm input 0 5 10 15 20 25 30 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 dc voltage [v] led current [ma] 0 5 10 15 20 25 30 0 20406080100 pwm hi duty [%] led current [ma] sw vin cin 4.7 f r1 470k ? cout 2.2 f vin 2.7v to 4.6v vout fb l1 10 h iset gnd en pwm led on/off reset dc r2 22k ?
13/22 datasheet d a t a s h e e t bd60a00nux bd60a60nux ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200320-1-2 27.sep.2012 rev.001 brightness control - continued 3) the brightness control to set large cu rrent over ic max setting current is made by giving dc control voltage to vfb pin of ic via a series resistor as shown in under figure. led lu minance (current) changed by giving dc voltage to vfb directly. dc voltage is given from filtered one of dac signal, or pwm signal shown in under figure. led current (iled) is next expression. iled = [[(fb-dc) / r1] * r2 + fb ] / rfb sw vin cin 4.7 f cout 2.2 f vin 2.7v to 4.6v vout fb l1 10 h iset gnd en pwm reset dc rfb 6.49 ? r2 6.8k ? 3s7p r1 22k ? sw vin cin 4.7 f cout 2.2 f vin 2.7v to 4.6v vout fb l1 10 h iset gnd en pwm reset pwm 5 ? 33k ? 3s7p 47k ? 100k ? 47nf 0 - 3.3v 0 20 40 60 80 100 120 140 160 0.0 0.5 1.0 1.5 2.0 2.5 3.0 dc [v] iled total [ma] bd60a60nux 3ledx7parallel 0 20 40 60 80 100 120 140 160 180 200 0 2040 6080100 pwm duty [%] st 20khz iled total [ma] bd60a60nux 3ledx7parallel
14/22 datasheet d a t a s h e e t bd60a00nux bd60a60nux ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200320-1-2 27.sep.2012 rev.001 the coil selection the dc/dc is designed by more than 4.7h. when l value sets to a lower value, it is possibility that the specific sub-harmonic oscillation of current mode dc / dc will be happened. please do not let l value to 3.3h or below. and, l value increases, the phase margin of dc / dc becomes to zero. please enlarge the output capacitor value when you increase l value. output capacitor selection output capacitor smoothly keeps output voltage and supplies led current. if led current is set more than 20ma with vcoil=2.3v to 5. 5v, please make output capacitor more than 2.2f. otherwise phase margin of dc/dc decreases and might oscillate. output voltage consists of charge (fet on) and discharge (l ed current). so output volt age has output ripple voltage every fet switching. output ripple voltage is calculated as following. output ripple voltage - switching cycle = t - total led current = iled - switching on duty = d - output ripple voltage = v ripple - output capacitor = cout - ou tput capacitor (real value) = c real - decreasing ratio of capacitor = c error c real = cout c error (capacitor value is decreased by bias, so) c real = iled (1-d) t / v ripple cout = iled (1-d) t / v ripple / c error (example 1) in case of, vin=5.0v, fsw = 0.6mhz, vout =32.5v, iled =20ma, cout = 2.2f, c error = 50% t = 1 / 0.6mhz d = 1 ? vin / vout = 1 ? 5/32.5 v ripple = iled (1-d) t / (coutc error ) = 20ma (5/32.5) (1 / 0.6mhz) / (2.2f0.5) = 4.7mv led selection please select led vf that input voltage is smaller than output voltage (vout). 0v 35v 50v output voltage capa [f] cout c real
15/22 datasheet d a t a s h e e t bd60a00nux bd60a60nux ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200320-1-2 27.sep.2012 rev.001 the separation of the ic power supply and coil power supply this ic can work in separating the power source in both ic power supply and coil power supply. with this application, it can obtain that decrease of ic power consumption, and the applied voltage exceeds ic rating 5.5v. that application is shown in below figure 8. the coil power supply is connected to high voltage source applied from adapters. then the ic power supply is con nected to the power supply that should be different from the coil power supply. figure 8. application at the time of power supply separation figure 9. application at the time of power supply common the number of available leds by each power supply voltage condition ccoil 4.7 f sw vin cin 4.7 f r1 24k ? cout 2.2 f 25ma vout fb l1 10 h iset gnd en pwm reset pwm input ic power 2.3v to 4.6v 1 cell battery dimmingled current setting25ma) 2.7v 3v v 5v 6v 7v 8v 9v 10v 11v 12v 13v 14v 15v 16v 17v 18v 19v 20v 2 cs cs cs cs 3 cs cs cs cs s s 4 cs cs cs cs s s s s s 5 cs cs cs cs s s s s s s s 6 cs cs cs cs s s s s s s s s s 7 cs cs cs cs s s s s s s s s s s s 8 cscscscssssssssss sss 9 cscscscsssssssssssssss 10 cscscscssssssssssssssss c???vcoil-vin common power supply s???vcoil-vin separated power supply ???no use due to led terminal over voltage protection vin leds 3 sw vin cin 1 f r1 24k ? cout 2.2 f 25ma coil power 2.3v to 20v vout fb l1 10 h iset gnd en pwm reset pwm input ic power 2.7v to 4.6v step down dc/dc 2,3cell battery
16/22 datasheet d a t a s h e e t bd60a00nux bd60a60nux ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200320-1-2 27.sep.2012 rev.001 about the order of a power supply injection at the time of power supply separation even if the ic power supply is 0v, leak channel is blocked as pull down resistor for power off is placed inside the ic. the resistor intercepts leak channel from coil power supply. additionally, there is no order for standing up and down of coil and ic power supply. ? at the time of starting it doesn?t matter whether coil power or ic power becomes activated first. ? at the time of power supply off please turn off after make en terminal ?l?. if power supply voltage of coil power becomes low, coil current increases due to high boosting, which leads to over current limit. in order to avoid this state, before turning off a power supply it is necessary to su rely set en to l. input voltage 5v bd60a00nux the gnd noise become big by impedance of pcb boards, so t hat wake up characteristics might become unstable. to select input voltage to 5v(input voltage 4.61v ove r), we recommend under application to insert 4.7 ? between input voltage line and vin terminal sw vin cin 4.7 f riset 24k ? cout 2.2 f 25ma vin 2.7v to 5.5 v vout fb l1 10 h iset gnd en pwm reset pwm input 4.7 ? ic power en pwm vout coil power free
17/22 datasheet d a t a s h e e t bd60a00nux bd60a60nux ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200320-1-2 27.sep.2012 rev.001 pcb layout in order to make the most of the performance of this ic, its pc b layout is very important. characteristics such as efficiency and ripple and the likes change greatly with pcb layout, which please note carefully connect input capacitor cin as close as possible between coil l1 and gnd. connect schottky barrier diode sbd as close as possible between coils l1and sw pin. connect output capacitor cout between cathode of sbd and gnd. make both gnd sides of cin and cout as close as possible. > connect led current setting resistor riset(24k ? ) as close as possible between iset pin and gnd. there is possibility to oscillate when capacity is added to iset terminal, so pay attention that capacity isn?t added. pad is used for improving the efficiency of ic heat radiation. solder pad to gnd pin. moreover, connect ground plane of board using via as shown in the patterns of next page. the efficiency of heat radiation improves according to the area of ground plane. when those pins are not connec ted directly near the chip, influence is gi ve to the performance of bd60a00nux, and may limit the current drive performance. as for the wire to the inductor, make its resistan ce component small so as to reduce electric power consumption a nd increase the entire efficiency. the pcb layout in consideration of these is shown in the next page. sw vin cin 4.7 f riset 24k ? cout 2.2 f 25ma vin 2.7v to 4.6 v vout fb l1 10 h iset gnd en pwm reset pwm input sbd
18/22 datasheet d a t a s h e e t bd60a00nux bd60a60nux ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200320-1-2 27.sep.2012 rev.001 recommended pcb layout sbd coil
19/22 datasheet d a t a s h e e t bd60a00nux bd60a60nux ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200320-1-2 27.sep.2012 rev.001 selection of external parts recommended external parts are as shown below. when to use other parts than these, se lect the following equivalent parts. l1: this coil is for boosting. recommended capacity value is 10uh. please use the coil with adequate direct current capacity and also low direct current resistor. value manufacturer product number size dc current (ma) dcr ( ? ) vertical horizontal height 10h tdk vlf4012at-100mr79 4.0 3.8 1.2 800 0.30 10h tdk vlf302512mt-100m 3. 0 2.5 1.2 690 0.25 10h toko 1094as-100m 3.5 3.7 1.2 760 0.18 10h toko 1229as-h-100m 3.5 3.7 1.2 750 0.24 cin: this is bypath capacitor for power supply, which remo ves power supply noise occurred instantly and provides stable power supply for ic. in order to obtain better quality, please use low esr products such as ceramic capacitors. recommended capacity value is more than 1f. cout: this is output smoothing capacitor. recommended capacity value is 2.2f. when choosing capacitors such as cin and cout, please be careful of pressure. the base line of pressure is about 2 times of actual applying voltage. if pressure margin decreas es, it might be happened that capa city value becomes almost a half of nominal value. value pressur e manufactur e product number size vertical horizontal height [ cin : power supply voltage capacitor] 1.0f 10v. murata grm185b 31a105 1.6. 0.8. 0.5. [cout : output capacitor ] 1.0f 50v murata grm 31mb31h105 3.2 1.6 1.15 2.2f 50v murata grm31cb31h225 3.2 1.6 1.6 riset: led current iled should be decided when activated. value tolerance manufacturer product number size i led (ma) vertical horizontal height [riset : resistor used for deciding led current] 20k ? 0.5% rohm mcr03pzpzd 2002 1.6 0.8 0.45 30 24k ? 0.5% rohm mcr03pzpzd 2402 1.6 0.8 0.45 25 30k ? 0.5% rohm mcr03pzpzd 3002 1.6 0.8 0.45 20 56k ? 0.5% rohm mcr03pzpzd 5602 1.6 0.8 0.45 10.7 sbd: this schottky diode (sbd) is for output rectification. in order to obtain higher switching efficiency, please use low vf low reverse leak, and high current capacity. pressure manufacturer product number size vertical horizontal height 60v rohm rb160m-60 3.5 1.6 0.8 40v rohm rb521s-40 1.6 0.8 0.6 60v rohm rb060m-60 3.5 1.6 0.8
20/22 datasheet d a t a s h e e t bd60a00nux bd60a60nux ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200320-1-2 27.sep.2012 rev.001 operational notes (1) absolute maximum ratings an excess in the absolute maximum ratings, such as suppl y voltage (vin), temperature range of operating conditions (topr), etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. if any special mode exceeding the absolute maxi mum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) operating conditions these conditions represent a range within which characteri stics can be provided appr oximately as expected. the electrical characteristics are guaranteed under the conditions of each parameter. (3) reverse connection of power supply connector the reverse connection of power supply connector can br eak down ics. take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the ic?s power supply terminal. (4) power supply line design pcb pattern to provide low impedance for t he wiring between the power supply and the gnd lines. furthermore, for all power supply terminals to ics, mount a capacitor between the power supply and the gnd terminal. at the same time, in order to use an electrolytic capaci tor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occu rrence of capacity dropout at a low temperature, thus determining the constant. (5) gnd voltage make setting of the potential of the g nd terminal so that it will be maintained at the minimum in any operating state. furthermore, check to be sure no terminals are at a potent ial lower than the gnd voltage including an actual electric transient. (6) short circuit between terminals and erroneous mounting in order to mount ics on a set pcb, pay thorough attention to the direction and offset of the ics. erroneous mounting can break down the ics. furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the gnd terminal, the ics can break down. (7) operation in strong electromagnetic field be noted that using ics in the strong elec tromagnetic field can malfunction them. (8) inspection with set pcb on the inspection with the set pcb, if a capacitor is connect ed to a low-impedance ic terminal, the ic can suffer stress. therefore, be sure to discharge from t he set pcb by each process. furthermore, in order to mount or dismount the set pcb to/from the jig for the inspection process, be sure to turn off the power supply and then mount the set pcb to the jig. after the completion of the inspection, be sure to tu rn off the power supply and then dismount it from the jig. in addition, for protection against static electricity, establis h a ground for the assembly process and pay thorough attention to the transportation and t he storage of the set pcb. (9) input terminals in terms of the construction of ic, parasitic elements are in evitably formed in relation to potential. the oper ation of the parasitic element can cause interference with circuit operati on, thus resulting in a malfunction and then breakdown of the input terminal. therefore, pay thoroug h attention not to handle the input termi nals, such as to apply to the input terminals a voltage lower than the gnd respectively, so that any parasitic element will operate. furthermore, do not apply a voltage to the input terminals when no power supply vo ltage is applied to the ic. in addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (10) ground wiring pattern if small-signal gnd and large-current gnd are provided, it will be recommended to separate the large-current gnd pattern from the small-signal gnd pattern and establish a si ngle ground at the reference poi nt of the set pcb so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal gnd. pay att ention not to cause fluctuations in the gnd wiring pattern of external parts as well. (11) external capacitor in order to use a ceramic capacitor as the external capacitor, determine the c onstant with consideration given to a degradation in the nominal capacitance due to dc bias and c hanges in the capacitance due to temperature, etc. (12) thermal shutdown circuit (tsd) when junction temperatures become 175 ? c (typ.) or higher, the thermal shutdo wn circuit operates and turns a switch off. the thermal shutdown circuit, which is aimed at isolat ing the lsi from thermal runaway as much as possible, is not aimed at the protection or guarantee of the lsi. therefor e, do not continuously use the lsi with this circuit operating or use the lsi assuming its operation. (13) thermal design perform thermal design in which there ar e adequate margins by taking into account the permissible dissipation (pd) in actual states of use. (14) selection of coil select the low dcr inductors to decrease power loss for dc/dc converter.
21/22 datasheet d a t a s h e e t bd60a00nux bd60a60nux ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200320-1-2 27.sep.2012 rev.001 ordering information b d 6 0 a x 0 n u x - t r part number package nux: vson008x2030 packaging and forming specification tr: embossed tape and reel marking diagram physical dimension tape and reel information status of this document the japanese version of this document is fo rmal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority. marking part number d 6 0 a 0 0 bd60a00nux d 6 0 a 6 0 bd60a60nux vson008x2030 (top view) part number marking lot numbe r 1pin mark ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 4000pcs tr () direction of feed reel 1pin (unit : mm) vson008x2030 5 1 8 4 1.4 0.1 0.25 1.5 0.1 0.5 0.3 0.1 0.25 +0.05 ? 0.04 c0.25 0.6max (0.12) 0.02 +0.03 ? 0.02 3.0 0.1 2.0 0.1 1pin mark 0.08 s s
22/22 datasheet d a t a s h e e t bd60a00nux bd60a60nux ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200320-1-2 27.sep.2012 rev.001 revision history date revision changes 27.sep.2012 001 new release
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. notice general precaution 1) before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2) all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1) our products are designed and manufactured for applicat ion in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. 2) rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4) the products are not subjec t to radiation-proof design. 5) please verify and confirm characteristics of the final or mounted products in using the products. 6) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7) de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8) confirm that operation temperature is within t he specified range described in the product specification. 9) rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2) you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3) store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1) all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2) no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. other precaution 1) the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3) the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4) in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

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